世界のウェーハレベルパッケージ市場2020:企業別、地域別、種類別、用途別、市場予測2025

GlobalInfoResearchが発行した調査報告書(GIR20OC12429)
◆英語タイトル:Global Wafer Level Package Market 2020 by Company, Regions, Type and Application, Forecast to 2025
◆商品コード:GIR20OC12429
◆発行会社(リサーチ会社):GlobalInfoResearch
◆発行日:2020年10月(※2024年版があります。お問い合わせください。)
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本書では、ウェーハレベルパッケージの世界市場を調査対象にし、ウェーハレベルパッケージの市場概要、企業情報、企業別売上・市場シェア、地域別市場分析(北米、アメリカ、ヨーロッパ、アジア、日本、中国、南米、中東・アフリカ)、種類別分析(3Dワイヤボンディング、3D TSV、その他)、用途別分析(家電、産業用、自動車・輸送、IT・電気通信、その他)、市場予測(2021年~2025年)情報などを整理しました。
・市場概要
・企業情報:lASE、Qualcomm、Samsung、Amkor、JCET、Intel、SK Hynix、Toshiba、AT&S、IBM、UTAC、Interconnect Systems、TSMC、China Wafer Level CSP
・企業別売上、市場シェア
・ウェーハレベルパッケージの地域別市場分析
・ウェーハレベルパッケージの北米市場規模2015-2020:アメリカ、カナダ、メキシコ
・ウェーハレベルパッケージのヨーロッパ市場規模2015-2020:ドイツ、イギリス、フランス、ロシアなど
・ウェーハレベルパッケージのアジア市場規模2015-2020:日本、中国、韓国、インド、東南アジアなど
・ウェーハレベルパッケージの南米市場規模2015-2020:ブラジル、アルゼンチンなど
・ウェーハレベルパッケージの中東・アフリカ市場規模2015-2020:サウジアラビア、トルコ、エジプト、南アフリカなど
・ウェーハレベルパッケージの種類別市場規模2015-2020:3Dワイヤボンディング、3D TSV、その他
・ウェーハレベルパッケージの用途別市場規模2015-2020:家電、産業用、自動車・輸送、IT・電気通信、その他
・ウェーハレベルパッケージの世界市場予測2021-2025:地域別、種類別、用途別
・調査の結果・結論
【レポートの概要】

Market Overview
The global Wafer Level Package market size is expected to gain market growth in the forecast period of 2020 to 2025, with a CAGR of xx% in the forecast period of 2020 to 2025 and will expected to reach USD xx million by 2025, from USD xx million in 2019.

The Wafer Level Package market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

Market segmentation
Wafer Level Package market is split by Type and by Application. For the period 2015-2025, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

By Type, Wafer Level Package market has been segmented into:
3D Wire Bonding
3D TSV
Others

By Application, Wafer Level Package has been segmented into:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others

Regions and Countries Level Analysis
Regional analysis is another highly comprehensive part of the research and analysis study of the global Wafer Level Package market presented in the report. This section sheds light on the sales growth of different regional and country-level Wafer Level Package markets. For the historical and forecast period 2015 to 2025, it provides detailed and accurate country-wise volume analysis and region-wise market size analysis of the global Wafer Level Package market.

The report offers in-depth assessment of the growth and other aspects of the Wafer Level Package market in important countries (regions), including:
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia and Australia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Competitive Landscape and Wafer Level Package Market Share Analysis
Wafer Level Package competitive landscape provides details by vendors, including company overview, company total revenue (financials), market potential, global presence, Wafer Level Package sales and revenue generated, market share, price, production sites and facilities, SWOT analysis, product launch. For the period 2015-2020, this study provides the Wafer Level Package sales, revenue and market share for each player covered in this report.

The major players covered in Wafer Level Package are:
lASE
Qualcomm
Samsung
Amkor
JCET
Intel
SK Hynix
Toshiba
AT&S
IBM
UTAC
Interconnect Systems
TSMC
China Wafer Level CSP

【レポートの目次】

Table of Contents

1 Wafer Level Package Market Overview
1.1 Product Overview and Scope of Wafer Level Package
1.2 Classification of Wafer Level Package by Type
1.2.1 Global Wafer Level Package Revenue by Type: 2015 VS 2019 VS 2025
1.2.2 Global Wafer Level Package Revenue Market Share by Type in 2019
1.2.3 3D Wire Bonding
1.2.4 3D TSV
1.2.5 Others
1.3 Global Wafer Level Package Market by Application
1.3.1 Overview: Global Wafer Level Package Revenue by Application: 2015 VS 2019 VS 2025
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive & Transport
1.3.5 IT & Telecommunication
1.3.6 Others
1.4 Global Wafer Level Package Market by Regions
1.4.1 Global Wafer Level Package Market Size by Regions: 2015 VS 2019 VS 2025
1.4.2 Global Market Size of Wafer Level Package (2015-2025)
1.4.3 North America (USA, Canada and Mexico) Wafer Level Package Status and Prospect (2015-2025)
1.4.4 Europe (Germany, France, UK, Russia and Italy) Wafer Level Package Status and Prospect (2015-2025)
1.4.5 Asia-Pacific (China, Japan, Korea, India and Southeast Asia) Wafer Level Package Status and Prospect (2015-2025)
1.4.6 South America (Brazil, Argentina, Colombia) Wafer Level Package Status and Prospect (2015-2025)
1.4.7 Middle East & Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa) Wafer Level Package Status and Prospect (2015-2025)
2 Company Profiles
2.1 lASE
2.1.1 lASE Details
2.1.2 lASE Major Business and Total Revenue (Financial Highlights) Analysis
2.1.3 lASE SWOT Analysis
2.1.4 lASE Product and Services
2.1.5 lASE Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.2 Qualcomm
2.2.1 Qualcomm Details
2.2.2 Qualcomm Major Business and Total Revenue (Financial Highlights) Analysis
2.2.3 Qualcomm SWOT Analysis
2.2.4 Qualcomm Product and Services
2.2.5 Qualcomm Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.3 Samsung
2.3.1 Samsung Details
2.3.2 Samsung Major Business and Total Revenue (Financial Highlights) Analysis
2.3.3 Samsung SWOT Analysis
2.3.4 Samsung Product and Services
2.3.5 Samsung Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.4 Amkor
2.4.1 Amkor Details
2.4.2 Amkor Major Business and Total Revenue (Financial Highlights) Analysis
2.4.3 Amkor SWOT Analysis
2.4.4 Amkor Product and Services
2.4.5 Amkor Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.5 JCET
2.5.1 JCET Details
2.5.2 JCET Major Business and Total Revenue (Financial Highlights) Analysis
2.5.3 JCET SWOT Analysis
2.5.4 JCET Product and Services
2.5.5 JCET Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.6 Intel
2.6.1 Intel Details
2.6.2 Intel Major Business and Total Revenue (Financial Highlights) Analysis
2.6.3 Intel SWOT Analysis
2.6.4 Intel Product and Services
2.6.5 Intel Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.7 SK Hynix
2.7.1 SK Hynix Details
2.7.2 SK Hynix Major Business and Total Revenue (Financial Highlights) Analysis
2.7.3 SK Hynix SWOT Analysis
2.7.4 SK Hynix Product and Services
2.7.5 SK Hynix Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.8 Toshiba
2.8.1 Toshiba Details
2.8.2 Toshiba Major Business and Total Revenue (Financial Highlights) Analysis
2.8.3 Toshiba SWOT Analysis
2.8.4 Toshiba Product and Services
2.8.5 Toshiba Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.9 AT&S
2.9.1 AT&S Details
2.9.2 AT&S Major Business and Total Revenue (Financial Highlights) Analysis
2.9.3 AT&S SWOT Analysis
2.9.4 AT&S Product and Services
2.9.5 AT&S Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.10 IBM
2.10.1 IBM Details
2.10.2 IBM Major Business and Total Revenue (Financial Highlights) Analysis
2.10.3 IBM SWOT Analysis
2.10.4 IBM Product and Services
2.10.5 IBM Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.11 UTAC
2.11.1 UTAC Details
2.11.2 UTAC Major Business and Total Revenue (Financial Highlights) Analysis
2.11.3 UTAC SWOT Analysis
2.11.4 UTAC Product and Services
2.11.5 UTAC Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.12 Interconnect Systems
2.12.1 Interconnect Systems Details
2.12.2 Interconnect Systems Major Business and Total Revenue (Financial Highlights) Analysis
2.12.3 Interconnect Systems SWOT Analysis
2.12.4 Interconnect Systems Product and Services
2.12.5 Interconnect Systems Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.13 TSMC
2.13.1 TSMC Details
2.13.2 TSMC Major Business and Total Revenue (Financial Highlights) Analysis
2.13.3 TSMC SWOT Analysis
2.13.4 TSMC Product and Services
2.13.5 TSMC Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
2.14 China Wafer Level CSP
2.14.1 China Wafer Level CSP Details
2.14.2 China Wafer Level CSP Major Business and Total Revenue (Financial Highlights) Analysis
2.14.3 China Wafer Level CSP SWOT Analysis
2.14.4 China Wafer Level CSP Product and Services
2.14.5 China Wafer Level CSP Wafer Level Package Revenue, Gross Margin and Market Share (2018-2019)
3 Market Competition, by Players
3.1 Global Wafer Level Package Revenue and Share by Players (2015-2020)
3.2 Market Concentration Rate
3.2.1 Top 5 Wafer Level Package Players Market Share
3.2.2 Top 10 Wafer Level Package Players Market Share
3.3 Market Competition Trend
4 Market Size by Regions
4.1 Global Wafer Level Package Revenue and Market Share by Regions
4.2 North America Wafer Level Package Revenue and Growth Rate (2015-2020)
4.3 Europe Wafer Level Package Revenue and Growth Rate (2015-2020)
4.4 Asia-Pacific Wafer Level Package Revenue and Growth Rate (2015-2020)
4.5 South America Wafer Level Package Revenue and Growth Rate (2015-2020)
4.6 Middle East & Africa Wafer Level Package Revenue and Growth Rate (2015-2020)
5 North America Wafer Level Package Revenue by Countries
5.1 North America Wafer Level Package Revenue by Countries (2015-2020)
5.2 USA Wafer Level Package Revenue and Growth Rate (2015-2020)
5.3 Canada Wafer Level Package Revenue and Growth Rate (2015-2020)
5.4 Mexico Wafer Level Package Revenue and Growth Rate (2015-2020)
6 Europe Wafer Level Package Revenue by Countries
6.1 Europe Wafer Level Package Revenue by Countries (2015-2020)
6.2 Germany Wafer Level Package Revenue and Growth Rate (2015-2020)
6.3 UK Wafer Level Package Revenue and Growth Rate (2015-2020)
6.4 France Wafer Level Package Revenue and Growth Rate (2015-2020)
6.5 Russia Wafer Level Package Revenue and Growth Rate (2015-2020)
6.6 Italy Wafer Level Package Revenue and Growth Rate (2015-2020)
7 Asia-Pacific Wafer Level Package Revenue by Countries
7.1 Asia-Pacific Wafer Level Package Revenue by Countries (2015-2020)
7.2 China Wafer Level Package Revenue and Growth Rate (2015-2020)
7.3 Japan Wafer Level Package Revenue and Growth Rate (2015-2020)
7.4 Korea Wafer Level Package Revenue and Growth Rate (2015-2020)
7.5 India Wafer Level Package Revenue and Growth Rate (2015-2020)
7.6 Southeast Asia Wafer Level Package Revenue and Growth Rate (2015-2020)
8 South America Wafer Level Package Revenue by Countries
8.1 South America Wafer Level Package Revenue by Countries (2015-2020)
8.2 Brazil Wafer Level Package Revenue and Growth Rate (2015-2020)
8.3 Argentina Wafer Level Package Revenue and Growth Rate (2015-2020)
9 Middle East & Africa Revenue Wafer Level Package by Countries
9.1 Middle East & Africa Wafer Level Package Revenue by Countries (2015-2020)
9.2 Saudi Arabia Wafer Level Package Revenue and Growth Rate (2015-2020)
9.3 UAE Wafer Level Package Revenue and Growth Rate (2015-2020)
9.4 Egypt Wafer Level Package Revenue and Growth Rate (2015-2020)
9.5 South Africa Wafer Level Package Revenue and Growth Rate (2015-2020)
10 Market Size Segment by Type
10.1 Global Wafer Level Package Revenue and Market Share by Type (2015-2020)
10.2 Global Wafer Level Package Market Forecast by Type (2019-2024)
10.3 3D Wire Bonding Revenue Growth Rate (2015-2025)
10.4 3D TSV Revenue Growth Rate (2015-2025)
10.5 Others Revenue Growth Rate (2015-2025)
11 Global Wafer Level Package Market Segment by Application
11.1 Global Wafer Level Package Revenue Market Share by Application (2015-2020)
11.2 Wafer Level Package Market Forecast by Application (2019-2024)
11.3 Consumer Electronics Revenue Growth (2015-2020)
11.4 Industrial Revenue Growth (2015-2020)
11.5 Automotive & Transport Revenue Growth (2015-2020)
11.6 IT & Telecommunication Revenue Growth (2015-2020)
11.7 Others Revenue Growth (2015-2020)
12 Global Wafer Level Package Market Size Forecast (2021-2025)
12.1 Global Wafer Level Package Market Size Forecast (2021-2025)
12.2 Global Wafer Level Package Market Forecast by Regions (2021-2025)
12.3 North America Wafer Level Package Revenue Market Forecast (2021-2025)
12.4 Europe Wafer Level Package Revenue Market Forecast (2021-2025)
12.5 Asia-Pacific Wafer Level Package Revenue Market Forecast (2021-2025)
12.6 South America Wafer Level Package Revenue Market Forecast (2021-2025)
12.7 Middle East & Africa Wafer Level Package Revenue Market Forecast (2021-2025)
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Data Source
14.3 Disclaimer
14.4 About US

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